Semiconductor Die Bonding and Vacuum Packaging System
Solicitation
N00173-26-RFI-KN02
Organization
DEPT OF DEFENSE.DEPT OF THE NAVY.ONR.ONR NRL.NAVAL RESEARCH LABORATORY
Posted
Jun 16, 2026
Response due
Jul 1, 202614 days left
Type
Sources Sought
Place of performance
District of Columbia 20375 UNITED STATES
Point of contact
- Name (1)
- KEVIN NGUYEN
- Email (1)
- kevin.nguyen3.civ@us.navy.mil
- Type (1)
- primary
- Name (2)
- Jamie Dixon
- Email (2)
- jamie.l.dixon8.civ@us.navy.mil
- Phone (2)
- (202)923-1466
- Type (2)
- secondary
Documents & attachments